RTM for phones should be pretty soon, yes I know we're all tired of hearing it's will be here "soon" but what else can we do other than wait?
As that static grid of icons is sooo 1992.
In regards to heat throttling on the 810 chip (20nm, well I don't think the 820 chip (14nm) will be any better unless they increase the die size. As the die shrinks the collective point of heat out put is going to get really concentrated. The 820 chip may be the inflection point where we see more and more liquid cooled phones as phones just don't have enough space for air to circulate. Not to mention they will be ridiculously uncomfortable to hold without any form of active cooling, anybody want a handled sauna? :winktongue: